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包裝：袋 類(lèi)別：工具 壓接器，壓接機(jī)，壓力機(jī) - 配件 描述：MOAS., HORIZONTAL TOGGLE CLAMPS,

Elesa USA Corporation

Thin Bow Type Resin Mold Package Infrared Emitting Diodes

■ Features 1. Thin bow type resin mold package (Resin area : 2.0 x 3.1 x 5.2 mm) 2. Low peak forward voltage (GL390V) VFM : TYP. 1.9V at IFM=0.5A ■ Applications 1. Cameras 2. Infrared remote controllers

文件：38.75 Kbytes 頁(yè)數(shù)：4 Pages

SHARPSharp Corporation

夏普

Thin Bow Type Resin Mold Package Infrared Emitting Diodes

■ Features 1. Thin bow type resin mold package (Resin area : 2.0 x 3.1 x 5.2 mm) 2. Low peak forward voltage (GL390V) VFM : TYP. 1.9V at IFM=0.5A ■ Applications 1. Cameras 2. Infrared remote controllers

文件：38.75 Kbytes 頁(yè)數(shù)：4 Pages

SHARPSharp Corporation

夏普

General Purpose Disc Ceramic Capacitors

General Purpose Disc Ceramic Capacitors ■ General Purpose ■ Ideal For Use in Non-critical Coupling, Bypass and Filter Applications ■ Conformally Coated ■ Radial Leads GENERAL SPECIFICATIONS Temperature Range: -30°C to +85°C Voltage Range: 50, 100, 500, 1,000, 2,000, 3,000 WVDC Cap

文件：469.39 Kbytes 頁(yè)數(shù)：3 Pages

MALLORY

馬洛里