描述 Description

EconoPIM??2 650V three phase PIM IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology

特性 Features

·Increased blocking voltage capability to 650V
·High Short Circuit Capability, Self Limiting Short Circuit Current
·T(vj op) = 150°C
·V(CEsat) with positive Temperature Coefficient
·Integrated NTC temperature sensor
·Isolated Base Plate
·Copper Base Plate

應(yīng)用 Application

?????Also available as variation with Soldering connection technology: FP75R07N2E4Please select a matching HV Gate Driver IC from our EiceDRIVER? Portfolio.With Infineon EiceDRIVER? Enhanced and Compact Driver ICs as well as EiceDRIVER? Safe Driver Boards we provide a broad spectrum of solutions for reliable and efficient controls of IGBT Modules.FP75R07N2E4_B11Data Sheet (1.1 MB, EN/CN)EN/DEEN/JAParametricFP75R07N2E4_B11Configuration?PIM Three Phase Input RectifierIC(nom) / IF(nom) ?75.0A?VCE(sat)(Tvj=25°C typ)?1.55V?VF(Tvj=25°C typ)?1.55V?Housing?EconoPIM? 2Dimensions(width)?45.0mm?Dimensions(length)?107.0mm?Data SheetTitleSizeDateVersionFP75R07N2E4_B11 (chinese/english)EN/CNEN/DEEN/JA1.1 MB23 七月 201402_01Product BrochureTitleSizeDateVersion1EDI EiceDRIVER? Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionIndustrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02利用單極柵電壓驅(qū)動IGBTCNEN384 KB03 十一月 201501_00Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009電力電子模塊內(nèi)部NTC的使用CNEN586 KB26 十一月 2013Mounting instruction for PressFIT with forked pinsENDE1.2 MB01 八月 201602_01Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014等效熱路模型CNEN500 KB25 十一月 2013如何正確計算并最大限度減小 IGBT 的死區(qū)時間CNEN1.5 MB26 八月 2013Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionEasy & Econo Power ModulesEN433 KB27 四月 201608_00PressFIT - Our established, reliable mounting technologyEN616 KB27 四月 201608_00EditorialsTitleSizeDateVersionCorrelating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand timeEN191 KB31 一月 2011Reliability of PressFIT connectionsEN472 KB06 六月 2008PressFIT Technology, a Solderless Method for Mounting Power ModulesEN377 KB24 一月 200601_00Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 五月 2014The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00Material Content Data SheetTitleSizeDateVersionMCDS - Econo2CEN37 KB06 一月 201403_00銷售產(chǎn)品名稱FP75R07N2E4_B11OPNFP75R07N2E4B11BOSA1產(chǎn)品狀態(tài)active and preferred在線訂購封裝名稱AG-ECONO2-4無鉛產(chǎn)品no無鹵no通過無鉛認(rèn)證yes包裝規(guī)格10包裝類型TRAYSimulation ToolTitleSizeDateVersionIPOSIMEN2.7 MB09 十二月 201607_09PressFIT TechnologyCustomers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications. 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