EP3CLS70集成電路(IC)的FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列)規(guī)格書(shū)PDF中文資料

廠(chǎng)商型號(hào) |
EP3CLS70 |
參數(shù)屬性 | EP3CLS70 封裝/外殼為484-BGA;包裝為托盤(pán);類(lèi)別為集成電路(IC)的FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列);產(chǎn)品描述:IC FPGA 278 I/O 484FBGA |
功能描述 | Cyclone III Device Handbook |
封裝外殼 | 484-BGA |
文件大小 |
7.30201 Mbytes |
頁(yè)面數(shù)量 |
274 頁(yè) |
生產(chǎn)廠(chǎng)商 | ALTERA |
中文名稱(chēng) | 阿爾特 |
網(wǎng)址 | |
數(shù)據(jù)手冊(cè) | |
更新時(shí)間 | 2025-8-11 23:39:00 |
人工找貨 | EP3CLS70價(jià)格和庫(kù)存,歡迎聯(lián)系客服免費(fèi)人工找貨 |
EP3CLS70規(guī)格書(shū)詳情
Cyclone III Device Family Overview
Cyclone? III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:
■ Cyclone III—lowest power, high functionality with the lowest cost
■ Cyclone III LS—lowest power FPGAs with security
With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ? watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.
This chapter contains the following sections:
■ “Cyclone III Device Family Features” on page 1–1
■ “Cyclone III Device Family Architecture” on page 1–6
■ “Reference and Ordering Information” on page 1–12
產(chǎn)品屬性
- 產(chǎn)品編號(hào):
EP3CLS70F484C7N
- 制造商:
Intel
- 類(lèi)別:
集成電路(IC) > FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列)
- 系列:
Cyclone? III
- 包裝:
托盤(pán)
- 電壓 - 供電:
1.15V ~ 1.25V
- 安裝類(lèi)型:
表面貼裝型
- 工作溫度:
0°C ~ 85°C(TJ)
- 封裝/外殼:
484-BGA
- 供應(yīng)商器件封裝:
484-FBGA(23x23)
- 描述:
IC FPGA 278 I/O 484FBGA
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
ALTERA |
20+ |
NA |
33560 |
原裝優(yōu)勢(shì)主營(yíng)型號(hào)-可開(kāi)原型號(hào)增稅票 |
詢(xún)價(jià) | ||
Intel/Altera |
24+ |
UBGA-484 |
6 |
優(yōu)勢(shì)代理渠道,原裝正品,可全系列訂貨開(kāi)增值稅票 |
詢(xún)價(jià) | ||
Intel/Altera |
24+ |
UBGA484 |
7350 |
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠(chǎng)技術(shù)支持!!! |
詢(xún)價(jià) | ||
Intel FPGAs/Altera |
23+ |
484-UBGA19x19 |
7300 |
專(zhuān)注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢(xún)價(jià) | ||
ALTERA/阿爾特拉 |
21+ |
NA |
7200 |
只做原裝支持終端 |
詢(xún)價(jià) | ||
ALTERA/阿爾特拉 |
21+ |
NA |
10000 |
只做原裝!原廠(chǎng)和代理商的搬運(yùn)工! |
詢(xún)價(jià) | ||
Intel FPGAs/Altera |
21+ |
484-FBGA |
3860 |
進(jìn)口原裝!長(zhǎng)期供應(yīng)!絕對(duì)優(yōu)勢(shì)價(jià)格(誠(chéng)信經(jīng)營(yíng) |
詢(xún)價(jià) | ||
ALTERA(阿爾特拉) |
23+ |
NA |
20094 |
正納10年以上分銷(xiāo)經(jīng)驗(yàn)原裝進(jìn)口正品做服務(wù)做口碑有支持 |
詢(xún)價(jià) | ||
ALTERA/阿爾特拉 |
2021+ |
1218 |
十年專(zhuān)營(yíng)原裝現(xiàn)貨,假一賠十 |
詢(xún)價(jià) | |||
ALTERA |
23+ |
BGAQFP |
8659 |
原裝公司現(xiàn)貨!原裝正品價(jià)格優(yōu)勢(shì). |
詢(xún)價(jià) |