首頁 >EBLS2012-2R2K>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
WireWoundMagneticallyShieldedSMDPowerInductor | ABRACON Abracon Corporation | ABRACON | ||
MULTILAYERCHIPINDUCTORS | ECEEXCEL CELL ELECTRONIC CO., LTD. 百容電子百容電子股份有限公司 | ECE | ||
POWERINDUCTOR ●FEATURE 1.MultilayerChipPowerInductor 2.Monolithicstructureforhighreliability 3.Excellentsolderabilityandhighheatresistance 4.Nocrosscouplingduetomagneticshield 5.HighDCbiascurrentduetodevelopedmaterial 6.LowDCresistance 7.OperatingTemp.:-40°C~+125°C | AITSEMIAiT Semiconductor Inc. 創(chuàng)瑞科技AiT創(chuàng)瑞科技 | AITSEMI | ||
SRN2012Series-Semi-shieldedPowerInductors Features Semi-shieldedconstruction Miniaturesize Lowprofile:1.2mm Inductancerange:0.24to2.2μH Ratedcurrentupto3.5A RoHScompliant*andhalogenfree** Applications DC/DCconverters Notebookcomputers Digitalvideocameras HDDs Cellphones Televisions,LCDdisplays | BournsBourns Electronic Solutions 伯恩斯 | Bourns |
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