首頁(yè) >CGA3E3X7S1A225K080AA>規(guī)格書列表
| 零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
MULTILAYERCERAMICCHIPCAPACITORS ■FEATURES ?Superiormechanicalstrengthandhighreliabilityduetothemonolithic structure ?OutstandingfrequencycharacteristicssuchaslowESRandlowESL bythesimplestructure ?Lowself-heatingvalueandhighresistancetorippleonaccountofthe lowESR ?Nopolarity ?AEC-Q20 | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
MultilayerCeramicChipCapacitors | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS FEATURES ?Highresistancetomechanicalstressandthermalshockbyresinlayers ?X8RandX8Ltypewhosemaximumtemperatureareupto150°Careavailable ?C0GtypehavingexcellentstabletemperatureandDC-biascharacteristicsisalsoavailable APPLICATIONS ?Fail-safedesignforbatte | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
MultilayerCeramicChipCapacitors | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK |
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