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首頁(yè)>CC2564CRVMR.B>規(guī)格書(shū)詳情

CC2564CRVMR.B中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

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廠(chǎng)商型號(hào)

CC2564CRVMR.B

功能描述

CC2564C Dual-Mode Bluetooth? Controller

絲印標(biāo)識(shí)

CC2564C

封裝外殼

VQFNP-MR

文件大小

788.93 Kbytes

頁(yè)面數(shù)量

58 頁(yè)

生產(chǎn)廠(chǎng)商

TI

中文名稱(chēng)

德州儀器

網(wǎng)址

網(wǎng)址

數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠(chǎng)下載

更新時(shí)間

2025-9-21 20:00:00

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CC2564CRVMR.B規(guī)格書(shū)詳情

1.1 Features 1

? TI's Single-Chip Bluetooth? Solution With

Bluetooth Basic Rate (BR), Enhanced Data Rate

(EDR), and Low Energy (LE) Support

? Bluetooth 5.1 Delaration ID D049226

? Highly Optimized for Size-Constrained and Low-

Cost Designs:

– Single-Ended 50-Ω RF Interface

– VQFNP-MR Package Family, RVM Footprint: 76

Terminals, 0.6-mm Pitch, 8-mm × 8-mm

? BR and EDR Features Include:

– Up to Seven Active Devices

– Scatternet: Up to Three Piconets

Simultaneously, One as Master and Two as

Slaves

– Up to Two Synchronous Connection Oriented

(SCO) Links on the Same Piconet

– Support for All Voice Air-Coding—Continuously

Variable Slope Delta (CVSD), A-Law, μ-Law,

Modified Subband Coding (mSBC), and

Transparent (Uncoded)

– Provide an Assisted Mode for HFP 1.6

Wideband Speech (WBS) Profile or A2DP

Profile to Reduce Host Processing and Power

– Support of Multiple Bluetooth Profiles With

Enhanced QoS

? Low Energy Features Include:

– Multiple Sniff Instances Tightly Coupled to

Achieve Minimum Power Consumption

– Independent Buffering for Low Energy Allows

Large Numbers of Multiple Connections Without

Affecting BR or EDR Performance

– Built-In Coexistence and Prioritization Handling

for BR, EDR, and Low Energy

– Capabilities of Link Layer Topology

Scatternet—Can Act Concurrently as Peripheral

and Central

– Network Support for up to 10 Devices

– Time Line Optimization Algorithms to Achieve

Maximum Channel Utliization

? Best-in-Class Bluetooth (RF) Performance (TX

Power, RX Sensitivity, Blocking)

– Class 1 TX Power up to +12 dBm

– Internal Temperature Detection and

Compensation to Ensure Minimal Variation in

RF Performance Over Temperature, No

External Calibration Required

– Improved Adaptive Frequency Hopping (AFH)

Algorithm With Minimum Adaptation Time

– Longer Range, Including Twice the Range of

Other Low-Energy-Only Solutions

? Advanced Power Management for Extended

Battery Life and Ease of Design

– On-Chip Power Management, Including Direct

Connection to Battery

– Low Power Consumption for Active, Standby,

and Scan Bluetooth Modes

– Shutdown and Sleep Modes to Minimize Power

Consumption

? Physical Interfaces:

– UART Interface With Support for Maximum

Bluetooth Data Rates

– UART Transport Layer (H4) With Maximum

Rate of 4 Mbps

– Three-Wire UART Transport Layer (H5) With

Maximum Rate of 4 Mbps

– Fully Programmable Digital Pulse-Code

Modulation (PCM)–I2S Codec Interface

? Flexibility for Easy Stack Integration and Validation

Into MCUs and MPUs

? HCI Tester Tool to Evaluate RF Performance of

the Device and Configure Service Pack

1.2 Applications

? Wireless Audio Solutions

? mPOS

? Medical Devices

? Set-Top Boxes (STBs)

? Wearable Devices

? Sensor Hub, Sensor Gateway

– Home and Factory Automation

1.3 Description

The CC2564C device from Texas Instruments? is a complete Bluetooth? BR/EDR, and low energy HCI

level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventhgeneration

Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-

compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer

topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other

Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host

MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and

software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low

energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The

iPod? (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode

Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

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TI(德州儀器)
24+
NA/
8735
原廠(chǎng)直銷(xiāo),現(xiàn)貨供應(yīng),賬期支持!
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TI(德州儀器)
2024+
VQFN-76-EP(8x8)
500000
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TEXAS INSTRUMENTS
23+
SMD
880000
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TI
24+
BGA
16500
只做原裝正品現(xiàn)貨 假一賠十
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TI
24+
QFN
5000
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TI
23+
QFN
2500
正規(guī)渠道,只有原裝!
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TI(德州儀器)
24+
N/A
6000
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TI
23+
76VQFN Dual Rows
9000
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TI(德州儀器)
23+
N/A
6000
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TI
23+
N/A
7000
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