描述 Description

Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.

特性 Features

? Fully automotive qualified to beyond AEC-Q101:
? -55 °C to +175 °C rating suitable for thermally demanding environments

? LFPAK88 package:
? Designed for smaller footprint and improved power density over older wire bond packages such as D2PAK for today’s space constrained high power automotive applications
? Thin package and copper clip enables LFPAK88 to be highly efficient thermally

? LFPAK copper clip technology enabling improvements over wire bond packages by:
? Increased maximum current capability and excellent current spreading
? Improved RDSon
? Low source inductance
? Low thermal resistance Rth

? LFPAK Gull Wing leads:
? Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
? Visual (AOI) soldering inspection, no need for expensive x-ray equipment
? Easy solder wetting for good mechanical solder joint

? Unique 40 V Trench 9 superjunction technology:
? Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
? Improved SOA and avalanche capability compared to standard TrenchMOS
? Tight VGS(th) limits enable easy paralleling of MOSFETs

應(yīng)用 Application

? 12 V automotive systems
? 48 V DC/DC systems (on 12 V secondary side)
? Higher power motors, lamps and solenoid control
? Reverse polarity protection
? LED lighting
? Ultra high performance power switching