特性 Features

Processor Cores:
? Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing
? Dual-core Arm? Cortex?-R5F cluster supports dual-core and single-core operation
? 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
? Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
? Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)

? TMS320C66x DSP core
? Single core, 32-bit, floating point DSP
? Operating at 450 MHz (14.4 GMAC)

Memory subsystem:
? Up to 5.0 MB On Chip RAM (OCSRAM)
? Memory space sharable between DSP, MCU, and shared L3
? 3.5625MB shared L3 memory
? 960KB dedicated to Main subsystem
? 384KB dedicated to DSP subsystem

? External Memory Interfaces (EMIF)
? QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:
? 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
? 5x Real-Time Interrupt (RTI) modules
? Mailbox system for Interprocessor Communication (IPC)
? JTAG/Trace interfaces for device debugging
? Clock source
? 40.0 MHz crystal with internal oscillator
? Supports external oscillator at 40/50 MHz
? Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:
? 10/100 Mbps Ethernet (RGMII/RMII/MII)
? Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
? Output: 4-lane Aurora/LVDS
General Connectivity Peripherals:
? General Purpose Analog to Digital Converters (GPADC)
? 1x 9-channel ADC supporting up to 625 Ksps

? Digital Connectivity
? 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
? 3x Inter-Integrated Circuit (I2C) ports
? 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:
? 3x Enhanced Pulse-Width Modulator (ePWM)
? 1x Enhanced Capture Module (eCAP)
? 2x Modular Controller Area Network (MCAN) modules with CAN-FD support
Power Management:
? Simplified power sequencing and reduced number of power supply rails
? Dual voltage digital I/O supporting 3.3V and 1.8V operation
Security:
? Device Security
? Programmable embedded Hardware Security Module (HSM)
? Secure authenticated and encrypted boot support
? Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
? Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:
? Functional Safety-Compliant targeted
? Developed for functional safety applications
? Documentation will be available to aid ISO 26262 functional safety system design
? Hardware integrity up to ASIL B targeted
? Safety-related certification
? ISO 26262 certification by TüV SüD planned


? AEC-Q100 qualification targeted
? Operating Conditions
? Automotive grade temperature range supported
? Industrial grade temperature range supported

Package options:
? ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
? 45-nm technology
? Compact solution size