描述 Description

FEATURES
? Compact flat body saves space
? With a small footprint of 10.6 mm (L) × 7.2 mm (W) .417 inch (L) × .283 inch (W) for space savings, it also has a very short height of 5.2 mm .205 inch. (Standard PC board type.)
? Outstanding surge resistance.
?? Surge withstand between open contacts:? 1,500 V 10×160 μs (FCC part 68)
?? Surge withstand between contacts and coil: 2,500 V 2×10 μs (Bellcore)
? The use of twin crossbar contacts ensures high contact reliability.
?? AgPd contact is used because of its good? sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.
? Increased packaging density
?? Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before.
? Nominal operating power: 140 mW
? Outstanding vibration and shock resistance.
?? Functional shock resistance: 750 m/s2 {75G}
?? Destructive shock resistance: 1,000 m/s2 {100G}
?? Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3? mm .130 inch)
?? Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)

特性 Features

? Compact flat body saves space
? With a small footprint of 10.6 mm (L) × 7.2 mm (W) .417 inch (L) × .283 inch (W) for space savings, it also has a very short height of 5.2 mm .205 inch. (Standard PC board type.)
? Outstanding surge resistance.
?? Surge withstand between open contacts:? 1,500 V 10×160 μs (FCC part 68)
?? Surge withstand between contacts and coil: 2,500 V 2×10 μs (Bellcore)
? The use of twin crossbar contacts ensures high contact reliability.
?? AgPd contact is used because of its good? sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.
? Increased packaging density
?? Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before.
? Nominal operating power: 140 mW
? Outstanding vibration and shock resistance.
?? Functional shock resistance: 750 m/s2 {75G}
?? Destructive shock resistance: 1,000 m/s2 {100G}
?? Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3? mm .130 inch)
?? Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)?