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5962-1022101VSC.Z中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

5962-1022101VSC.Z
廠商型號

5962-1022101VSC.Z

功能描述

TPS50601-SP Radiation Hardened 1.6- to 6.3-V Input, 6-A Synchronous Buck Converter

文件大小

1.24953 Mbytes

頁面數(shù)量

42

生產(chǎn)廠商

TI

中文名稱

德州儀器

網(wǎng)址

網(wǎng)址

數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-9-6 17:52:00

人工找貨

5962-1022101VSC.Z價格和庫存,歡迎聯(lián)系客服免費人工找貨

5962-1022101VSC.Z規(guī)格書詳情

1 Features

1? 5962R10221:

– Radiation Hardness Assurance (RHA) up to

TID 100 krad (Si)

– ELDRS Free 100 krad (Si) – 10 mRAD(Si)/s

– Single Event Latchup (SEL) Immune to

LET = 85 MeV-cm2/mg (See Radiation Report)

– SEB and SEGR Immune to 85 MeV-cm2/mg,

SOA Curve Available (See Radiation Report)

– SET/SEFI Cross-Section Plot Available (See Radiation Report)

? Peak Efficiency: 95% (V O = 3.3 V)

? Integrated 55-mΩ/50-mΩ MOSFETs

? Split Power Rail: 1.6 to 6.3 V on PVIN

? Power Rail: 3 to 6.3 V on VIN

? 6-A Maximum Output Current

? Flexible Switching Frequency Options:

– 100-kHz to 1-MHz Adjustable Internal

Oscillator

– External Sync Capability: 100 kHz to 1 MHz

– Sync Pin can be Configured as a 500-kHz

Output for Master/Slave Applications

? 0.795-V ±1.258% Voltage Reference at 25°C

? Monotonic Start-Up into Prebiased Outputs

? Adjustable Soft Start Through External Capacitor burn?

Input Enable and Power-Good Output for Power

Sequencing

? Power Good Output Monitor for Undervoltage and

Overvoltage

? Adjustable Input Undervoltage Lockout (UVLO)

? 20-Pin Thermally-Enhanced Ceramic Flatpack

Package (HKH)

? See www.ti.com/swift for SWIFT? Documentation

? See the Tools & Software Tab

2 Applications

? Space Satellite Point of Load Supply for FPGAs,

Microcontrollers, and ASICs

? Space Satellite Payloads

? Radiation-Tolerant Applications

? Available in Military (–55°C to 125°C)

Temperature Range

? Engineering Evaluation (/EM) Samples are

Available(1)

3 Description

The TPS50601-SP is a radiation hardened, 6.3-V, 6-

A synchronous step-down converter, which is

optimized for small designs through high efficiency

and integrating the high-side and low-side MOSFETs.

Further space savings are achieved through current

mode control, which reduces component count, and a high switching frequency, reducing the inductor's

footprint. The devices are offered in a thermally

enhanced 20-pin ceramic, dual in-line flatpack

package.

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