General Description

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ203N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).

特性 Features

? 7.5 A, 20 V. RDS(ON) = 18 m? @ VGS = 4.5 RDS(ON) = 30 m? @ VGS = 2.5 V

? Occupies only 4 mm2 of PCB area. Less than 40 of the area of a SSOT-6

? Ultra-thin package: less than 0.80 mm height when mounted to PCB

? Ultra-low Qg x RDS(ON) figure-of-merit.

? High power and current handling capability.

Applications

? Battery management

? Load switch

? Battery protection