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NXP i.MX6 Cortex-A9 RISC Embedded Mini-ITX Box Computer

Features ? NXP ARM Cortex-A9 i.MX6 Dual/Quad 1GHz high performance processor ? On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash ? Supports Dual Display: VGA/HDMI ? Supports 1 x mini-PCIe, 4 x serial ports, 6 x USB, 1 x M.2 socket,8 x GPIO, 1 x CAN ? Low power consumption, fanless

文件：3.18839 Mbytes 頁(yè)數(shù)：4 Pages

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Industrial-Grade Nvidia Jetson Barebone Box PC

Features ? NVIDIA Jetson Module compatible Barebone PC ? Industrial and Expandable Design ? HDMI up to 3840 x 2160 at 60Hz resolution ? Dual GbE LAN, 2 USB3.2 Gen 1 ? 1 Micro SD Socket & 1 Nano SIM Slot ? 1 M.2 3042 Key B Slot, 1 M.2 2230 Key E Slot ? 4 Kinds of Rear I/O for Each Vertical F

文件：1.20611 Mbytes 頁(yè)數(shù)：3 Pages

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NXP i.MX8M Plus Cortex?-A53 Edge AI RISC-based Box Computer

Features ? NXP i.MX8M Plus Cortex?-A53 Quad Core 1.6GHz ? On-board LPDDR4 6 GB, 4000MT/s memory ? HDMI up to 3840 x 2160 at 30Hz resolution ? Dual GbE LAN, 1 USB2.0 and 1 USB3.2 Gen 1 ? 1 Micro SD Socket & 1 Nano SIM Slot ? 1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot ? Yocto Linux and Andr

文件：3.13995 Mbytes 頁(yè)數(shù)：4 Pages

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Intel? Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ? 2Tx/2Rx ? WPA2*, WPA3* ? 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ? Supports wide operating temperatures (-40~85°C / -40~185°F) ? Supports Windows 10*, Linux*, and Chrome OS* ?

文件：397.35 Kbytes 頁(yè)數(shù)：1 Pages

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Intel? Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ? 2Tx/2Rx ? WPA2*, WPA3* ? 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM,EAP-AKA, EAP-AKA') ? Supports wide operating temperatures (0 ~ 70 °C/32 ~ 158 °F) ? Supports Windows 10*, Linux*, and Chrome OS* ? W

文件：397.22 Kbytes 頁(yè)數(shù)：1 Pages

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Intel? Wireless 6E AX210 (Vpro) M.2 2230 A-E Key module with cables and antennas

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ? 2Tx/2Rx ? WPA2*, WPA3* ? 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ? Supports wide operating temperatures (-40 ~ 85 °C/-40 ~ 185 °F) ? Supports Windows 10*, Linux*, and Chrome OS*

文件：397.22 Kbytes 頁(yè)數(shù)：1 Pages

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802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ? IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ? Supports MU-MIMO (2T2R) ? Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ? Supports Linux OS ? M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

文件：386.39 Kbytes 頁(yè)數(shù)：1 Pages

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IEEE 802.11ax/ac/a/b/g/n Bluetooth 5.2 M.2 2230 (A-E Key) Card

Features ? IEEE 802.11ax/a/b/g/n + Bluetooth 5.2 ? Supports 2.4 GHz: 2.412 ~ 2.484 GHz , 5 GHz: 4.915 ~5.925GHz ? MU-MIMO, 2Tx/2Rx ? Operating temperature: 0~ 70°C (32~158°F)

文件：312.76 Kbytes 頁(yè)數(shù)：1 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 LGA Module

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ? 2Tx/2Rx ? Wi-Fi: WPA/WPA2/WPA3 ? Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ? Supports Linux ? Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ? BT: LTE/MWS coexistence

文件：352.73 Kbytes 頁(yè)數(shù)：1 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 M.2 2830 E key Module

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ? 2Tx/2Rx ? Wi-Fi: WPA/WPA2/WPA3 ? Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ? Supports Linux ? Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ? BT: LTE/MWS coexistence

文件：360.7 Kbytes 頁(yè)數(shù)：1 Pages

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